SILICON WAFER English meaning
silicon wafer Silicon wafers after cutting have sharp edges, and they chip easily Wafer edge is shaped to remove sharp, brittle edges; rounded edge minimizes risk for
Lapping refers to the process of grinding the Si wafer surface so as to remove the damaged layer caused by slicing process and to obtain Si silicone gel Nanoindentation tests were performed on ultraprecision diamond-turned silicon wafers and the results were compared with those of pristine silicon wafers
silicon wafer Silicon wafers after cutting have sharp edges, and they chip easily Wafer edge is shaped to remove sharp, brittle edges; rounded edge minimizes risk for
silicon wafer Lapping refers to the process of grinding the Si wafer surface so as to remove the damaged layer caused by slicing process and to obtain Si
Nanoindentation tests were performed on ultraprecision diamond-turned silicon wafers and the results were compared with those of pristine silicon wafers